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Bonding of silicon carbide directly to a semiconductor substrate by using silicon to silicon bonding
Bonding of silicon carbide directly to a semiconductor substrate by using silicon to silicon bonding
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机译:通过使用硅与硅的键合将碳化硅直接键合到半导体衬底
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摘要
A module and a method of making the module is disclosed. The module is formed from a semiconductor substrate and a silicon carbide chip for high temperature applications. The module is designed to be compatible with current silicon IC processes.
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