首页> 外国专利> Process for manufacturing ultra-sharp atomic force microscope (AFM) and scanning tunneling microscope (STM) tips

Process for manufacturing ultra-sharp atomic force microscope (AFM) and scanning tunneling microscope (STM) tips

机译:超尖原子力显微镜(AFM)和扫描隧道显微镜(STM)尖端的制造方法

摘要

A method for manufacturing probe tips suitable for use in an atomic force microscope (AFM) or scanning tunneling microscope (STM) begins by depositing a layer of a first material over a substrate and then patterning the layer of the first material to define apertures wherever probe tips are to be formed. Next, a layer of a second material is deposited using an unbiased high density plasma chemical vapor deposition (HDPCVD) process to form sharp probe tips in the apertures in the layer of the first material. The HDPCVD process also forms a sacrificial layer of the second material on top of the portions of the first material not removed by the patterning step. The sacrificial layer at least partially overhangs the apertures in the first material, forming a shadow mask during the deposition process which gives rise to a sharp probe profile. After the formation of the probe tips, the remaining portion of the layer of first material is removed using a wet chemical etchant that selectively etches the first material at a much higher rate than the second material. The removing step also removes the sacrificial layer of the second material because the sacrificial layer is lifted off the substrate when the underlying layer of first material is etched away. In one preferred embodiment, the first material is silicon nitride and the second material is silicon dioxide.
机译:一种制造适用于原子力显微镜(AFM)或扫描隧道显微镜(STM)的探针的方法,该方法首先在衬底上沉积一层第一材料,然后构图该第一材料的层以在任何探针处形成孔技巧将形成。接下来,使用无偏高密度等离子体化学气相沉积(HDPCVD)工艺沉积第二材料层,以在第一材料层的孔中形成尖锐的探针尖端。 HDPCVD工艺还在第一材料的未被图案化步骤去除的部分的顶部上形成第二材料的牺牲层。牺牲层至少部分悬在第一材料中的孔上,在沉积过程中形成荫罩,从而产生尖锐的探针轮廓。在形成探针尖端之后,使用湿化学蚀刻剂去除第一材料层的剩余部分,该湿化学蚀刻剂以比第二材料高得多的速率选择性地蚀刻第一材料。去除步骤还去除了第二材料的牺牲层,因为当第一材料的下面的层被蚀刻掉时,牺牲层被从衬底上提起。在一个优选的实施方案中,第一材料是氮化硅,第二材料是二氧化硅。

著录项

  • 公开/公告号US5965218A

    专利类型

  • 公开/公告日1999-10-12

    原文格式PDF

  • 申请/专利权人 VLSI TECHNOLOGY INC.;

    申请/专利号US19970819283

  • 发明设计人 SUBHAS BOTHRA;LING Q. QIAN;

    申请日1997-03-18

  • 分类号B05D5/12;H05H1/24;H01J9/04;

  • 国家 US

  • 入库时间 2022-08-22 02:07:04

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号