Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits

摘要

An interconnect structure is centered around a substrate having multiple component contacts for receiving electronic components. Multiple conductive traces are provided over the substrate or in multiple layers of the substrate. Each conductive trace is connected to one of the component contacts. A programmable IC having a group of separate conductive leads is connected to the substrate. Two or more of the conductive leads are connected to corresponding ones of the conductive traces. The IC has programmable elements, such as electrically programmable elements, for selectively connecting the conductive leads, thereby enabling selected conductive traces to be interconnected so as to achieve a desired electrical function from the electronic components connected to the substrate. A test chip, an interconnect structure that contains the test chip, and a related test method are also provided.