METHOD FOR INSPECTING WHETHER PACKAGE FOR SEMICONDUCTOR CHIP IS GOOD OR NOT, ITS APPARATUS AND PROBE PIN STRUCTURE USED FOR IT

摘要

PROBLEM TO BE SOLVED: To make a probe pin easily, quickly and exactly come into contact with a contact point of soldering part for finely separated chips and a contact point of soldering part for a substrate. SOLUTION: A package 1 for semiconductor chip provided with a soldering part for a chip soldered to a semiconductor chip side and a soldering part for substrate soldered individually to a printed substrate prepared at a remote position from the soldering part for the chip is fixedly placed. A soft insulation plate 13 having a multitude of conductor wires which are embedded on so that more than one can individually contact each contact point of the soldering part for chips and the open end is exposed to both surface of front and back is laid over. After making the contact probes 19 of fixtures 18 individually contact the contact points 6, one probe pin 21 provided with a conductive small ball part 24 at the tip end is made to run in the plane direction on the surface of the corresponding portion of the soldering part for chips of the soft insulation plate 13 and whether the package 1 for semiconductor chip is good or not, is judged by the distribution state of the resistance obtained when it is individually brought into contact with each conductor.