PROBE SUBSTRATE FOR INSPECTING QUALITY OF SEMICONDUCTOR CHIP, MANUFACTURING METHOD OF THIS PROBE SUBSTRATE, AND QUALITY INSPECTING DEVICE OF SEMICONDUCTOR CHIP USING THIS PROBE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To enable the fine adjustments of a position to place a semiconductor chip by forming a conductive protrusion which comes into contact with the pad of the chip on a wiring pattern on a transparent substrate. ;SOLUTION: One side of a quartz glass substrate 1 is vacuum-deposited into an approximately 0.1μm-thick copper conductive film 2 and in addition is plated with approximately 10μm-wide electrolytic copper. A photoresist is applied over there, and after a photographing process, an approximately 10μm-wide micro-wiring pattern 3 is formed. An approximately 20μm-wide positive-type photoresist 4 for thick application is applied over it, exposure and development are performed, and a resist opening part 6 is formed in a location matching an aluminium pad. Next, nickel plating is performed to a thickness of approximately 20μm almost enough to bridge the resist opening part 6, and hard gold plating is performed over there to a thickness of approximately 0.1μm. Then the photoresist 4 is fused and removed to form a conductive protrusion. Next, the quartz glass substrate 1 is cut into a suitable size to complete a transparent probe 8. Thereby, it is possible to verify the state of mutual contact and position displacements.;COPYRIGHT: (C)1998,JPO