PROCESSOR, METHOD OF PREVENTING PEELING OF ADHESIVE USING THE SAME PROCESSOR AND MANUFACTURE OF SEMICONDUCTOR DEVICE, STRUCTURAL ELEMENTS OF THE SAME DEVICE AND FOCUSING RING

摘要

PROBLEM TO BE SOLVED: To control peeling of an adhesive layer of reaction byproducts and coating of a device surface to reduce particles within a chamber by structuring at least a part of the structural element within a processing tank to have the surface consisting of a plurality of small areas substantially divided with vertical level difference area. ;SOLUTION: The part of the upper and lower quartz jigs 18, 20 where reaction byproducts adhere is provided with the surface consisting of a plurality of small areas divided by the level different areas, namely the surface (level difference processing area) which is substantially divided with the recesses divided with the vertical level difference areas. Particularly, since deposition of adhesive is distinctive at the part of the lower quartz jig 20 located at the area near the lower electrode 16, it is suitable to provide the level difference processing area at the area near the lower electrode 16 of the lower quartz jig 20. Moreover, when adhesive deposited to the jig located at the area near the wafer is peeled, the peeled adhesive is attracted by an electrostatic chuck and it is impossible to fix the wafer. For this purpose, setting of the level difference processing area is effective.;COPYRIGHT: (C)2000,JPO