ANODIC CHEMICAL CONVERSION EQUIPMENT, ELECTRODE FOR ANODIC CHEMICAL CONVERSION, AND TREATMENT AND MANUFACTURE OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To reduce the contamination of a silicon substrate and the occurrence of abnormal chemical conversion at anodic chemical conversion treatment. ;SOLUTION: The part between the surface side of a silicon substrate 101 to be an object of treatment and a negative electrode 106 is filled with an HF solution 107, and an annular positive electrode 110 is brought into contact with the rear side of the silicon substrate. 101 to apply anodic chemical conversion treatment to the substrate. The surface of the positive electrode 110 is provided with a groove 110a for vacuum-sucking the silicon substrate 101. By adopting the annular positive electrode 110, the contact area between the silicon substrate 101 and the positive electrode 110 can be decreased and the contamination of the silicon substrate 101 can be reduced. Further, by making the positive electrode 110 suck the silicon substrate 101, the occurrence of abnormal chemical conversion caused by the deformation of the silicon substrate 101 owing to internal stress can be reduced.;COPYRIGHT: (C)2000,JPO