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HIGH FREQUENCY SUPERIMPOSING MODULE FOR OPTICAL PICKUP

机译:光学拾取的高频叠加模块

摘要

PROBLEM TO BE SOLVED: To make a module able to cope with optical pickups having various shapes without degrading their functions and characteristics. ;SOLUTION: A substrate 15 has a conductive pattern. An oscillation circuit section 1 includes a transistor Q1, capacitors C1 to C3 and C6 and inductors L1 and L2. An impedance matching section 3 includes capacitors C4 and C5 and is connected to the last stage of the section 1. The capacitors C1 to C3, the inductors L1 and L2 of the section 1 and the capacitors C4 and C5 of the section 3 are made into an integrated part by laminated compound parts. The transistor Q1 and the laminated compound parts are mounted on the substrate and required circuit wirings are conducted by the conductive pattern.;COPYRIGHT: (C)2000,JPO
机译:要解决的问题:使模块能够应对具有各种形状的光学拾取器而不会降低其功能和特性。 ;解决方案:衬底15具有导电图案。振荡电路部分1包括晶体管Q1,电容器C1至C3和C6以及电感器L1和L2。阻抗匹配部分3包括电容器C4和C5,并且连接到部分1的最后一级。电容器C1至C3,部分1的电感器L1和L2以及部分3的电容器C4和C5被制成。由层压复合零件组成的整体零件。晶体管Q1和叠层复合部件安装在基板上,所需的电路布线通过导电图案导电。;版权所有:(C)2000,JPO

著录项

  • 公开/公告号JP2000276757A

    专利类型

  • 公开/公告日2000-10-06

    原文格式PDF

  • 申请/专利权人 TDK CORP;

    申请/专利号JP19990082553

  • 发明设计人 TAKAHARA MASASHI;

    申请日1999-03-25

  • 分类号G11B7/125;H01S5/062;H05K1/02;

  • 国家 JP

  • 入库时间 2022-08-22 02:00:09

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