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HIGH FREQUENCY SUPERIMPOSING MODULE FOR OPTICAL PICKUP
HIGH FREQUENCY SUPERIMPOSING MODULE FOR OPTICAL PICKUP
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机译:光学拾取的高频叠加模块
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摘要
PROBLEM TO BE SOLVED: To make a module able to cope with optical pickups having various shapes without degrading their functions and characteristics. ;SOLUTION: A substrate 15 has a conductive pattern. An oscillation circuit section 1 includes a transistor Q1, capacitors C1 to C3 and C6 and inductors L1 and L2. An impedance matching section 3 includes capacitors C4 and C5 and is connected to the last stage of the section 1. The capacitors C1 to C3, the inductors L1 and L2 of the section 1 and the capacitors C4 and C5 of the section 3 are made into an integrated part by laminated compound parts. The transistor Q1 and the laminated compound parts are mounted on the substrate and required circuit wirings are conducted by the conductive pattern.;COPYRIGHT: (C)2000,JPO
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