CONDUCTIVE CORPUSCLE, ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE CONNECTION STRUCTURAL BODY

摘要

PROBLEM TO BE SOLVED: To lower a connection resistance correspondingly to a hyperfine electrode and to enhance reliability, by coating conductive material on the surface of a corpuscular sphere having a specific average particle diameter, an aspect ratio and a CV value. ;SOLUTION: This corpuscular sphere has an average particle diameter of 0-5-2.5 μm, an aspect ratio of less than 1.3, and a CV value of not more than 20%. Its K value is preferably 100-2000 kgf/mm2, and its recovery ratio is preferably not less than 40%. The corpuscular sphere is preferably coated by metal plating as a conductive material. Plating by noble metal, gold in particular is preferable in terms of oxidization resistance on a contact surface with an electrode. A thickness of plating is preferably 5-200 nm. It is recommended that gold plating be applied by using a displacement plating method after forming metal plating on the corpuscular sphere as a substrate for gold plating. Nickel plating is preferable for metal plating as the substrate. The corpuscular sphere with gold plating applied preferably has lightness of not less than 3 and chroma of not less than 2.;COPYRIGHT: (C)2000,JPO