CONDUCTIVE CORPUSCLE, ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide anisotropic conductive adhesive and a conductive connection structure having a low connection resistance, a large current capacity when connected, high connection reliability and not causing leakage phenomenon, and conductive corpuscles for them. ;SOLUTION: The external surface of this conductive corpuscle is gold-plated, and the corpuscle diameter is 0.2-100 μm, an aspect ratio is less than 1.5, a coefficient of variation is not more than 50%, lightness of the corpuscle is not less than 4 and saturation is not less than 3.3. The corpuscle diameter of the gold-plated corpuscle is 1-25 μm, a coefficient of variation is not more than 15%, an aspect ratio is less than 1.1, hue of the corpuscle is YR or Y and saturation is not less than 5. The corpuscle diameter of the gold-plated corpuscle is 2-10 μm, a coefficient of variation is not more than 7%, an aspect ratio is less than 1.06, lightness of the corpuscle is not less than 6, saturation is not less than 7 and K value of base material corpuscle is 200-5000 kgf/mm². Anisotropic conductive adhesive contains the conductive corpuscles. A conductive connection structure is connected by the conductive corpuscles or the anisotropic conductive adhesive.;COPYRIGHT: (C)1999,JPO