CONDUCTIVE FINE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE CONNECTION STRUCTURAL BODY

摘要

PROBLEM TO BE SOLVED: To deal with a minute electrode or the like and to realize low connection resistance and high reliability by forming conductive fine particles by covering the surfaces of fine spheres having a specific average particle diameter, aspect ratio, CV value and percentage content of Si with a conductive substance.;SOLUTION: Fine spheres having an average particle diameter of 0.5-100 μm, an aspect ratio less than 1.3, a CV value of 15% or less and a percentage content of Si equal to or more than 4 wt.% are covered with a metal or the like, so that the generation of gaps between electrode surfaces and them, the generation of non-contact fine particles and fatigue due to repetitive compression are prevented. Fine spheres of a resin or silica spheres having an average particle diameter of 1-20 μm, an aspect ratio less than 1.2, a CV value of 10% or less, a K value of 300-6000 kgf/mm2 and a recovery rate against repetitive compression of 50% or more are preferable. After a base is formed on each of the fine particles having a percentage content of Si of 8-30 wt.% by means of electrodeless plating or the like, gold of a noble metal is plated in a thickness of 50 nm or more, and thereby, brightness and chroma are preferably set to six or more and seven or more, respectively, so that an initial conductive characteristic and long-term reliability are improved.;COPYRIGHT: (C)2000,JPO