ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE CONNECTION STRUCTURAL BODY

摘要

PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive capable of bonding, in a satisfactorily conductive condition, a board, an electric component or the like on which electrodes are formed regardless of the kinds of electrodes such as soft electrodes or hard electrodes. ;SOLUTION: This anisotropic conductive adhesive contains hard conductive fine particles having an average particle diameter of 0.3-50 μm and soft conductive fine particles larger than the hard conductive fine particles, and the average particle diameter of the hard conductive fine particles is 0.2-0.95 time as large as that of the soft conductive fine particles.;COPYRIGHT: (C)1999,JPO