首页> 外国专利> Hg-BASED II-VI COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

Hg-BASED II-VI COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

机译:基于汞的II-VI族复合半导体器件及其制造

摘要

PROBLEM TO BE SOLVED: To increase both the resolution and the withstanding voltage of an HgCdTe semiconductor device by making the carrier density near a pn junction on the surface of a p-type Hg-based II-VI compound semiconductor substrate smaller than that in a bulk. ;SOLUTION: In a p-type Hg-based II-VI compound semiconductor substrate 1, an n-type region 2 which constitutes a one-dimentional or two-dimentional photodiode array is formed. The surface of the p-type Hg-system II-VI compound semiconductor substrate 1 is treated with excited hydrogen to make the carrier density in part of the surface of the substrate near the n-type region 2 smaller than that in a bulk. Then, a pn junction 3 is formed in that region where the carrier density is smaller than that in a bulk. Thereby, both the resolution and the withstanding voltage of an HgCdTe semiconductor device can be increased.;COPYRIGHT: (C)2000,JPO
机译:要解决的问题:通过使p型基于Hg的II-VI化合物半导体衬底表面上pn结附近的载流子密度小于在HgCdTe半导体器件中的pn结处的载流子密度,来提高HgCdTe半导体器件的分辨率和耐电压。块。 ;解决方案:在基于p型Hg的II-VI化合物半导体衬底1中,形成一个构成一维或二维光电二极管阵列的n型区域2。用激发氢处理p型Hg系II-VI化合物半导体衬底1的表面,以使n型区域2附近的衬底表面的一部分中的载流子密度小于整体中的载流子密度。然后,在载流子密度小于整体的载流子密度的那个区域中形成pn结3。因此,可以提高HgCdTe半导体器件的分辨率和耐压性。版权所有:(C)2000,JPO

著录项

  • 公开/公告号JP2000091620A

    专利类型

  • 公开/公告日2000-03-31

    原文格式PDF

  • 申请/专利权人 FUJITSU LTD;

    申请/专利号JP19980254910

  • 申请日1998-09-09

  • 分类号H01L31/10;H01L21/205;H01L27/14;

  • 国家 JP

  • 入库时间 2022-08-22 01:59:12

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