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METHOD OF EVALUATING LIGHT EMISSION CHARACTERISTICS OF EPITAXIAL WAFER FOR LIGHT EMITTING DIODE

机译:发光二极管外延片发光特性的评估方法

摘要

PROBLEM TO BE SOLVED: To obtain a correlation between the light emission intensity and brightness of a light emitting diode by means that an epitaxial diode for the light emitting diode has at least a light emitting layer located at a specified depth from the surface and surface layer formed on the light emitting layer having a smaller band gap than that of the light emitting layer, the small region has a specified circular shape, and trenches are at specified depth from the surface. ;SOLUTION: A small region 4 on the surface has a circular form with a diameter of 100-300 μm, and trenches 3 around the small region 4 are deeper by 3 μm or more than the depth of a light emitting layer 1 and at a depth of 20 μm or more from the surface, whereby a correlation can be obtd. between the light emission intensity measured in the state of an epitaxial wafer and brightness of a light emitting diode. This is because the small region is made circular at a diameter of 300 μm or less, the distance between the probe contact point in the small region and side the face of the trench is short, light picked up from the side face of the epitaxial layer facing the trench increases, and reflected light at the trench bottom face can be picked out as the trench depth is set to 20 μm or more.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:通过使用于发光二极管的外延二极管具有至少位于距表面和表面层特定深度的发光层,来获得发光二极管的发光强度和亮度之间的相关性。在具有比发光层的带隙小的带隙的发光层上形成的小区域具有特定的圆形形状,并且沟槽距表面一定深度。 ;解决方案:表面上的小区域4呈直径为100-300μm的圆形,并且围绕小区域4的沟槽3比发光层1的深度深3μm或更多,并且在距表面20μm或更大的深度,从而可以消除相关性。在外延晶片状态下测得的发光强度与发光二极管的亮度之间的差。这是因为小区域被制成直径为300μm或更小的圆形,小区域中的探针接触点与沟槽的侧面之间的距离短,从外延层的侧面拾取的光当沟槽深度设置为20μm或更大时,面对沟槽的表面会增加,并且可以拾取在沟槽底面的反射光。;版权:(C)1999,JPO

著录项

  • 公开/公告号JPH11354834A

    专利类型

  • 公开/公告日1999-12-24

    原文格式PDF

  • 申请/专利权人 SHOWA DENKO KK;

    申请/专利号JP19980154665

  • 申请日1998-06-03

  • 分类号H01L33/00;

  • 国家 JP

  • 入库时间 2022-08-22 01:58:43

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