Compositions curable epoxy for use in the field of microeletrÈnica

摘要

b compositions curable epoxy for use in the field of microeletru00c8nica d , the present invention relates to curable compositions based on epoxy for use in the field of microeletru00f3nica,Such as those having an epoxy compound that has two or more epoxy groups per molecule, and optionally, a compound of politiol that has two or more thiol groups per molecule.A latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the components above room temperature.The solid organic acid may be selected from group which consists of: the aliphatic carboxylic acids, and aromatic cicloalifu00e1tico and its derivatives, aliphatic quinones.Cycloaliphatic and aromatics and their derivatives, phenols and their derivatives and aliphatic and aromatic compounds, cicloalifu00e1ticos enolizu00e1veis and their derivatives.The solid organic acid should have a pKa less than or equal to approximately 12.0.Preferably smaller than or equal to approximately 10 and frequ00b3entemente smaller than or equal to approximately 9.0, such as less than or equal to approximately 7.5.The invention also relates to curable compositions based on epoxy, including a compound of epoxide, a component that confers thixotropy.A latent hardener, and at least one of the solid organic acids prior to demonstrating improved rheological properties.Such as the maintenance of pour point and maintenance of viscosity with time.