A method of manufacturing a semiconductor device which causes no short circuit therein because of dust floating in the air, a semiconductor device, a narrow pitch connector, a micromachine such as an electrostatic actuator or a piezoelectric actuator, and an ink jet head, an ink jet printer, a liquid crystal panel, and an electronic apparatus including these devices are disclosed. The method of manufacturing a plurality of semiconductor devices (20) by dicing a silicon wafer (30) comprises making grooves (30a) covered with insulating layers in the silicon wafer and extending across dicing lines and dicing the wafer along the dicing lines.
展开▼
