The mold of the present invention is for molding a package body composed of a lead frame having holes and a semiconductor chip provided on the lead frame. The mold is composed of an upper and lower forming die and a package body fixed by the upper and lower forming dies. The bottom shaping die has a runner, a table connected to the runner and protruding from the bottom of the runner, a bottom recess connected to the table, and a bottom gate disposed between the table and the bottom recess. The upper forming die has a resin storage unit in which a hole of a lead frame is positioned between the resin storage unit and the table and the table is corresponding, and the upper and lower recesses are formed of a cavity for molding the package body and connected to the resin storage unit. An upper recess and an upper gate provided between the resin reservoir and the upper recess are provided.
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