ATOMIC LAYER THIN FILM DEPOSITING APPARATUS CAPABLE OF BEING A THIN FILM DEPOSITING PROCESS OF A PLURALITY OF SUBSTRATES

摘要

PURPOSE: An atomic layer thin film depositing apparatus is provided to improve a deposition efficiency per a unit time by depositing a thin film of a fine pattern on a plurality of substrates at the same time. CONSTITUTION: The atomic layer thin film depositing apparatus comprises: a reaction container (200a) installed in a vacuum chamber (100) and containing a plurality of substrates (201); and a gas supplying part (200b) installed to be opposed to the reaction container for supplying a reaction gas and a fussing gas into the reaction container. The reaction container includes a body part having openings at one side of the body part; a plurality of stage parts formed to be divided in the body part by modules (210) of the body part and containing the substrates through the openings, respectively; and a plurality of gas supplying lines formed at the other sides of the modules to be passed through with the stage parts, for making gases supplied from the gas supplying part be inserted to the stage parts through the path.