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METHOD AND APPARATUS FOR APPLYING UNIFORM MAGNETIC FIELD TO TARGET IN MAGNETRON SPUTTERING
METHOD AND APPARATUS FOR APPLYING UNIFORM MAGNETIC FIELD TO TARGET IN MAGNETRON SPUTTERING
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机译:在磁控溅射中将均匀磁场应用于目标的方法和装置
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摘要
Purpose: one kind is provided for magnetic field to be equably applied to a mesh calibration method, in rotating parallel in a magnetron sputtering in the magnetic field on a surface of target. Construction: when electric current is applied in the one first and the 4th coil (30), on the one second of not electric current and tertiary coil (30), the South Pole is formed, on the one the 5th and the 6th coil (30) of not electric current, the arctic is formed, to generate the magnetic field on the surface for being parallel to target (20). Then, when electric current be applied in second and the 5th coil pass through application point by the variation tendency of relay when, South Pole for being formed on the third and fourth coil of not electric current and arctic and the not no first coil of electric current on 6th, generate the magnetic field for being parallel to the surface of target. Next, when electric current is applied in third and six coils by the variation tendency of application point, be formed on the 4th and the 5th coil of not electric current without the South Pole on electric current and the first and second coils of the arctic, generate the magnetic field for being parallel to the surface of target. Such continuous change using the electric current of point enables magnetic field to be uniformly applied to target.
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