INDUCTOR OR SMALL LOSS INTERCONNECT AND METHOD FOR PRODUCING INDUCTOR OR SMALL LOSS INTERCONNECT IN INTEGRATED CIRCUITS

摘要

PURPOSE: An inductor or small loss interconnect and a method for producing an inductor or small loss interconnect in integrated circuits are provided to increase the Q(quality factor) of the inductor by way of providing a buried layer, and a thick metal layer forming the body of the inductor. CONSTITUTION: An inductor or small loss interconnect and a method for producing an inductor or small loss interconnect in integrated circuits include a first and a second step. At the first step, a buried layer(105) is formed in a board(100). At the second step, a conduction layer(130) is formed on the buried layer(105). The buried layer(105) and the conduction layer(130) form an inductor. The concentration of doping in the buried layer(105) is changed to adjust the Q(quality factor) of the inductor.