Method of manufacturing and refilling sputter targets by thermal spray for use and reuse in thin film deposition

摘要

The method of the present invention is provided for producing and recharging the sputter target for use and re-use in a physical vapor deposition (physical vapor deposition) of a thin film on a semiconductor device. Target base shell (12, 22) is coated by thermal spraying technique (thermal spray technique) using a source material (14, 24) to be deposited as a thin film. A target (10, 20) is recharged by applying the coating when corrosion of the source material (14, 24) in a physical vapor deposition process again. The process of the present invention may use any conventional sputter target 20, or may be used in the hollow cathode magnetron sputter target 10 is newly developed.