Solder Ball Placement Units for Micro-Ball Grid Array Packages

摘要

The present invention relates to a solder ball placing device for supplying and placing solder balls in order to attach a plurality of solder balls to a lower surface of a substrate in a ball grid array package (BGA), in particular a micro-ball grid array package (μ-). BGA (solar ballast) provides solder ball placement devices for micro-ball grid array packages that allow solder balls of a certain size to be accurately positioned on the flux of the substrate, even with small solder balls. The present invention is to support the substrate to which the flux is applied, the substrate support for moving in the up and down direction and inclined at a predetermined angle when fully raised to maintain the working state; A ball placement plate disposed on the upper portion of the substrate support to be inclined at an angle equal to the inclination angle formed when the support is fully raised and having a plurality of solder ball through holes formed in a lattice structure; A ball loading box installed on an upper portion of the ball placing plate so as to be movable along the length direction and having a space for accommodating a plurality of solder balls; Nitrogen supply port is integrally installed in the ball loading box, the end of which is inclined upward from the lower side of the ball loading box to selectively block the falling of the solder ball while supplying nitrogen, and removes the extra ball. ; And a nitrogen amount controller for controlling the supply or the amount of nitrogen through the nitrogen supply port.