Wafer wet treatment before the direction and a process for treating a wafer in a wafer wet treatment before the direction of

摘要

A wafer wet treatment apparatus has an external bath (41) which is connected to a first supply/discharge line (41-2) and which contains an internal bath (50) connected to a second supply/discharge line (55), one or more partitions (43-45) being arranged on a section (52) of the internal bath (50). Preferably, the first line (41-2) acts as a supply line for the external bath when the second line (55) acts as a discharge line for the internal bath and vice-versa. Also claimed are processes for treating a wafer in the above apparatus, involving either (i) supplying a first solution through the supply line (41-2) and the external bath (41) to the internal bath (50), draining the first solution from the internal bath (50) through the discharge line (55), removing the or each partition (43-45) from the internal bath (50), supplying a second solution through the supply line (41-2) to the internal bath (50) and draining the second solution through the discharge line (55); or supplying a first solution through the supply line (55) to the internal bath (50), allowing the first solution to overflow into the external bath (41), draining the first solution from the external bath (41) through the discharge line (41-2), removing the or each partition (43-45) from the internal bath (50) and supplying a second solution to the internal bath (50).