Metal electrodeposition process, especially for plastic and copper surface regions of circuit boards, uses a nickel and-or cobalt reduction plating bath containing a stabilizer to prevent autocatalytic deposition

摘要

Metal electrodeposition on non-conductive surfaces, using a nickel and/or cobalt reduction plating bath containing a stabilizer to prevent autocatalytic deposition. Metal is electrodeposited on non-conductive surfaces by treating with a precious metal-activation bath, treating with a nickel and/or cobalt reduction plating bath and electrodepositing the metal layer, the novelty being that the deposition bath contains (a) a stabilizing compound to prevent autocatalytic nickel and/or cobalt deposition; or (b) -15 mg/l lead as a lead(II) compound. An Independent claim is also included for a nickel and/or cobalt deposition bath containing a nickel and/or cobalt ion source, a nickel and/or cobalt ion reducing agent and a stabilizing compound for preventing autocatalytic nickel and/or cobalt deposition. The non-conductive surfaces are conditioned with a substance for promoting adsorption of precious metal nuclei.