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Integrated circuit voltage supply via pad e.g. for microprocessors and microcontrollers

机译:经由垫的集成电路电压供应例如用于微处理器和微控制器

摘要

The invention relates to a circuit configuration for supplying power to an integrated circuit via a pad, whereby the pad is connected to the input of a Schmitt trigger on the integrated circuit and is provided for configuring the integrated circuit, whereby the integrated circuit is supplied with a multitude of supply voltages. According to the invention, the pad is connected to each supply voltage via a switch and the switches are switched on or off by a control circuit which is controlled by at least one chip-internal control signal.
机译:本发明涉及一种用于通过焊盘向集成电路供电的电路配置,其中焊盘被连接到集成电路上的施密特触发器的输入端,并且被提供用于配置集成电路,由此向集成电路供电多种电源电压。根据本发明,焊盘通过开关连接到每个电源电压,并且开关由控制电路接通或断开,该控制电路由至少一个芯片内部控制信号控制。

著录项

  • 公开/公告号DE19936606C1

    专利类型

  • 公开/公告日2000-10-26

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE19991036606

  • 发明设计人 KIRCHHOFF HANS-GERD;

    申请日1999-08-04

  • 分类号H01L23/58;H01L23/50;

  • 国家 DE

  • 入库时间 2022-08-22 01:42:06

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