Lead-free tin-bismuth solder alloy, for soldering metals e.g. in electrical equipment, contains copper and nickel and/or germanium

摘要

A tin-bismuth solder alloy, with specified contents of silver, copper and nickel and/or germanium, is new. A novel solder alloy has the composition (by wt.) = 21% Bi, = 4% Ag, = 2% Cu, = 0.2% Ni and/or = 0.1% Ge and balance Sn.