Brief description of the reflow soldering of producing components using the pre - deposits of brazing alloy and a device for brazing the implementation of such a process

摘要

The invention concerns a method for brazing by solder reflow electronic components (22) on a support (20), which consists in: providing a solder alloy which has been subjected to a pre-deposit on the support sites for connecting the components and/or which has been subjected to a pre-deposit on sites/terminations of the components properly speaking; depositing curable glue on the support (20) bonding sites; and carrying out a dry process fluxing of the support by contacting said support with a fluxing atmosphere comprising excited or unstable species substantially free from electrically charged species.