Air-packed CCD images package and a mold for manufacturing thereof

摘要

A plastic lid having a cavity portion is put to cover a pedestal from its front-surface side to its side-surface side, the pedestal having a semiconductor chip mounted thereon. An adhesive agent is charged into a space between the plastic lid and the pedestal so as to bond the plastic lid with the pedestal. Accordingly, a window frame is not necessary, corona discharge treatment or the like is not necessary, and it is therefore not necessary to use a B-stage thermosetting adhesive agent to thereby reduce the manufacturing cost of a semiconductor device of a hollow package structure having such a plastic lid. If a UV radiation setting adhesive agent or a visible radiation setting adhesive agent is used as the adhesive agent, cure time in bonding can be reduced.