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Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same
Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same
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机译:具有预定焦距的模制图像传感器封装结构的制造方法和使用该结构的结构
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摘要
Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same;A manufacturing method of a molded image sensor packaging structure with a predetermined focal length and the structure using the same are disclosed. The manufacturing method includes: providing a substrate (S10); providing a chip (S20) disposed on the substrate; providing a lens module (S30) set over the sensing area of the chip to form a semi-finished component; providing a mold (S40) that has an upper mold member with a buffer layer; disposing the semi-finished component into the mold to form a mold cavity therebetween (S50); injecting a molding compound into the mold cavity (S60); and after transfer molding the molding compound, opening the mold and performing a post mold cure process to cure the molding compound (S70). The buffer layer (711) can fill the air gap between the upper surface of the lens module (50) and the upper mold member (71), thereby preventing the upper surface of the lens module (50) from being polluted by the molding compound (80).
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