Mold for package molding and method of manufacturing plastic solid-state imaging device package using the mold and package

摘要

The present invention relates to a mold for molding a package, a method of manufacturing a plastic solid-state imaging device package using the mold, and a package, in which a semiconductor chip is fixedly mounted on paddles of a lead frame and the inner lead of the lead frame is connected to a metal wire Assembled state of the product to form an electrical signal transmission system is formed by transfer molding using a mold having a protrusion formed in a middle portion of a cavity of the upper mold die to form a package body having an upper portion of the light receiving region of the chip opened , And the glass lead for light transmission is mounted on the upper end of the opening of the package body. By using the plastic resin having a low cost and excellent moldability, the manufacturing cost is reduced, the productivity is improved, and the package manufacturing process is simplified And so on.