Application of wire bond loop as integrated circuit package component interconnect

摘要

A method of forming an interconnection contact for integrated circuit package components includes providing an integrated circuit package component having a contact pad on which the interconnecting contact is to be formed. The interconnecting contact is formed by forming at least a portion of a bonding wire loop connected to the contact pad. A first end of a bonding wire is connected to the contact pad. The bonding wire loop includes a wire portion extending outwardly from the contact pad. The portion of the bonding wire loop forms the interconnection contact for electrically connecting the integrated circuit package component to other electrical devices. In one embodiment, a second end of the bonding wire loop is connected to the same contact pad that the first end of the bonding wire loop is connected to. In another embodiment, a second end of the bonding wire loop is connected to another contact pad. The integrated circuit package component may be an integrated circuit die or an interconnecting device such as an interconnecting substrate for interconnecting other integrated circuit package components or for connecting the integrated circuit package to other electrical elements. An encapsulating material may be used to encapsulate the particular surface of the integrated circuit package component, the contact pad, and portions of the bonding wire loop.