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Method for measuring current density in a semiconductor device with kink effect

机译:具有扭结效应的半导体器件中电流密度的测量方法

摘要

A method for measuring kink effect of a first semiconductor device including the following steps is disclosed herein. Firstly, choose a second and a third semiconductor device. The first, the second and the third semiconductor device have the same channel length and different channel width. The next step, apply a voltage on the drain electrode of respective semiconductor device. The voltage is applied to the drain electrode and the DIBL effect is avoided. The following step, measure the threshold voltage of every. Next, measure the source to drain current by applying the respective threshold voltages on the respective gate electrode of every semiconductor device. Subsequently, generates a slope by dividing a first drain current difference by a first channel width difference. The first drain current difference is formed of subtracting a second drain to source current of the second semiconductor devices by and a third drain to source current of the third semiconductor device. The first channel width difference is formed of subtracting the second channel width of the second semiconductor device and the third channel width of the third semiconductor device. Then, subtract a first drain to source current of the first semiconductor device by a product to acquire a parasitic current. The product is formed of the product of the slope and the channel width of the third semiconductor. Finally, divide the parasitic current by a channel length of the first semiconductor device to obtain the linear current density as the index representing the kink effect of the first semiconductor device.
机译:本文公开了一种用于测量第一半导体器件的扭结效应的方法,该方法包括以下步骤。首先,选择第二和第三半导体器件。第一,第二和第三半导体器件具有相同的沟道长度和不同的沟道宽度。下一步,在各个半导体器件的漏极上施加电压。将电压施加到漏极,避免了DIBL效应。下一步,测量每个的阈值电压。接下来,通过在每个半导体器件的相应栅电极上施加相应的阈值电压来测量源极到漏极的电流。随后,通过将第一漏极电流差除以第一沟道宽度差来产生斜率。第一漏极电流差是通过将第二半导体器件的第二漏极至源极电流减去第三半导体器件的第三漏极至源极电流而形成的。第一沟道宽度差是通过将第二半导体器件的第二沟道宽度与第三半导体器件的第三沟道宽度相减而形成的。然后,通过乘积减去第一半导体器件的第一漏极至源极电流以获取寄生电流。该乘积由第三半导体的斜率和沟道宽度的乘积形成。最后,将寄生电流除以第一半导体器件的沟道长度,以获得线性电流密度作为表示第一半导体器件的扭结效应的指标。

著录项

  • 公开/公告号US6060900A

    专利类型

  • 公开/公告日2000-05-09

    原文格式PDF

  • 申请/专利权人 UNITED SEMICONDUTOR CIRCUIT CORP.;

    申请/专利号US19980106752

  • 发明设计人 MENG-LIN YEH;

    申请日1998-06-30

  • 分类号G01R31/26;

  • 国家 US

  • 入库时间 2022-08-22 01:37:13

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