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Multi-layer approach for optimizing ferroelectric film performance

机译:用于优化铁电薄膜性能的多层方法

摘要

A multi-layer ferroelectric thin film includes a nucleation layer, a bulk layer, and an optional cap layer. A thin nucleation layer of a specific composition is implemented on a bottom electrode to optimize ferroelectric crystal orientation and is markedly different from the composition required in the bulk of a ferroelectric film. The bulk film utilizes the established nucleation layer as a foundation for its crystalline growth. A multi-step deposition process is implemented to achieve a desired composition profile. This method also allows for an optional third composition adjustment near the upper surface of the film to ensure compatibility with an upper electrode interface and to compensate for interactions resulting from subsequent processing.
机译:多层铁电薄膜包括成核层,体层和可选的盖层。在底部电极上实现了特定组成的薄形核层,以优化铁电晶体的取向,并且明显不同于铁电膜主体中所需的组成。体膜利用已建立的成核层作为其晶体生长的基础。实施多步骤沉积工艺以实现期望的组成轮廓。该方法还允许在膜的上表面附近进行可选的第三组成调整,以确保与上电极界面的相容性,并补偿后续处理产生的相互作用。

著录项

  • 公开/公告号US6090443A

    专利类型

  • 公开/公告日2000-07-18

    原文格式PDF

  • 申请/专利权人 RAMTRON INTERNATIONAL CORPORATION;

    申请/专利号US19980064465

  • 发明设计人 BRIAN LEE EASTEP;

    申请日1998-04-22

  • 分类号C23C16/00;

  • 国家 US

  • 入库时间 2022-08-22 01:36:40

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