首页> 外国专利> Method of forming semiconductor devices using gate electrode dimensions and dopant concentration for controlling drive current strength

Method of forming semiconductor devices using gate electrode dimensions and dopant concentration for controlling drive current strength

机译:使用栅电极尺寸和掺杂剂浓度来控制驱动电流强度的半导体器件的形成方法

摘要

A semiconductor device having a controlled drive current strength is produced by varying dopant concentration to accommodate any variation in channel length, which is affected by variations in gate electrode dimension(s) from a desired value. After formation of the gate electrode on a substrate, its dimension(s) is measured and compared to a desired value. Based on any differences between the measured and desired values, the concentration of dopant implanted into the substrate is determined in order to counteract the variation in gate electrode dimension. This results in a change in dopant concentration that counteracts the effect of the variation in gate electrode dimension on the drive current strength. The present process provides enhanced control over the drive current strength of semiconductor devices and provides decreased variation within and between lots and corresponding increases in productivity.
机译:通过改变掺杂剂浓度以适应沟道长度的任何变化来生产具有受控驱动电流强度的半导体器件,该变化受栅电极尺寸相对于期望值的变化的影响。在衬底上形成栅电极之后,测量栅电极的尺寸并将其与期望值进行比较。基于测量值与期望值之间的任何差异,确定注入衬底中的掺杂剂的浓度,以便抵消栅电极尺寸的变化。这导致掺杂剂浓度的变化,该变化抵消了栅电极尺寸变化对驱动电流强度的影响。本方法提供了对半导体器件的驱动电流强度的增强控制,并减少了批内和批之间的变化,并相应提高了生产率。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号