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Method of forming semiconductor devices using gate electrode length and spacer width for controlling drive current strength
Method of forming semiconductor devices using gate electrode length and spacer width for controlling drive current strength
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机译:使用栅电极长度和间隔物宽度来控制驱动电流强度的半导体器件的形成方法
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摘要
A semiconductor device having a controlled drive current strength is produced by varying spacer width to accommodate any variation in gate electrode length from a desired value. After formation of the gate electrode on a substrate, the length is measured and compared to a desired value. Based on any differences between the measured and desired values, the width of spacer is determined in order to counteract the variation in gate electrode length. This results in maintaining the desired channel length after dopant implanting, to provide the desired drive current strength. The present process permits close control over the drive current strength of semiconductor devices and also decreased variation within and between lots and corresponding increases in productivity.
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