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Method of forming semiconductor devices using gate electrode length and spacer width for controlling drive current strength

机译:使用栅电极长度和间隔物宽度来控制驱动电流强度的半导体器件的形成方法

摘要

A semiconductor device having a controlled drive current strength is produced by varying spacer width to accommodate any variation in gate electrode length from a desired value. After formation of the gate electrode on a substrate, the length is measured and compared to a desired value. Based on any differences between the measured and desired values, the width of spacer is determined in order to counteract the variation in gate electrode length. This results in maintaining the desired channel length after dopant implanting, to provide the desired drive current strength. The present process permits close control over the drive current strength of semiconductor devices and also decreased variation within and between lots and corresponding increases in productivity.
机译:通过改变间隔物宽度以适应栅电极长度与期望值的任何变化,来制造具有受控驱动电流强度的半导体器件。在衬底上形成栅电极之后,测量长度并将其与期望值比较。基于测量值和期望值之间的任何差异,确定间隔物的宽度以便抵消栅电极长度的变化。这导致在掺杂剂注入之后保持期望的沟道长度,以提供期望的驱动电流强度。本方法允许对半导体器件的驱动电流强度进行严格控制,并且还可以减小批内和批之间的变化,并相应地提高生产率。

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