PURPOSE: To obtain an epoxy resin compsn. which gives a molded article having a low water absorption rate and a low stress by compounding an epoxy resin component contg. a specific polyglycidyl ether with a curative for an epoxy compd. ;CONSTITUTION: An epoxy resin component contg. at least 10wt.% polyglycidyl ether of a styrenated phenol novolac resin of formula I (wherein G is a group of formula II or III; R1 and R2 are each H, or a 10C or lower hydrocarbon group optionally substd. by halogen, provided that when R1 is the hydrocarbon group, then at least one H atom of R1 may be further substd. by OG; and (n) is 0, or 1-10) is compounded with a curative for an epoxy compd. When the compsn. is used for sealing, a phenol novolac resin is a pref. curative; in the use for a laminate for a printed circuit board, curing with dicyandiamide is pref.;COPYRIGHT: (C)1993,JPO&Japio
展开▼
