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Catalytic polymeric matrix to copper deposition, the preparation of the epoxy glass laminates and printed circuit board for a printed wiring board manufacturing

机译:催化聚合基体到铜的沉积,制备环氧玻璃层压板和印刷电路板,用于印刷线路板的制造

摘要

PURPOSE: To provide printed circuit board base materials which are catalytic to vapor deposition of metals, a process for producing these base materials and a process for producing printed circuit boards by using these base materials. ;CONSTITUTION: The high-polymer base materials which contain first catalysts consisting of granular silicate packing materials dispersed into the high- molecular base materials and arom. components dissolved in the polymers of the high-molecular base materials or having the hydroxyl substitutents adhered to these polymers and are catalytic to the vapor deposition of copper, further, the above base materials contg. the second catalysts selected from a group consisting of palladium, platinum, ruthenium, iridium, rhodium, silver or gold and their compds. and mixture; the process for producing these base materials; and the process for producing the printed circuit boards by using these base materials, are provided.;COPYRIGHT: (C)1992,JPO
机译:目的:提供对金属的气相沉积具有催化作用的印刷电路板基材,制备这些基材的方法和使用这些基材制备印刷电路板的方法。 ;组成:高聚物基础材料,其包含由分散在高分子基础材料和芳香族化合物中的颗粒状硅酸盐填充材料组成的第一催化剂。溶解在高分子基础材料的聚合物中的组分或具有羟基取代基附着在这些聚合物上并催化铜的气相沉积的组分,此外,上述基础材料也包括在内。第二种催化剂选自钯,铂,钌,铱,铑,银或金及其化合物。和混合物;这些基础材料的生产过程;并提供了使用这些基材生产印刷电路板的方法。;版权所有:(C)1992,日本特许厅

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