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Catalytic polymeric matrix to copper deposition, the preparation of the epoxy glass laminates and printed circuit board for a printed wiring board manufacturing
Catalytic polymeric matrix to copper deposition, the preparation of the epoxy glass laminates and printed circuit board for a printed wiring board manufacturing
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机译:催化聚合基体到铜的沉积,制备环氧玻璃层压板和印刷电路板,用于印刷线路板的制造
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摘要
PURPOSE: To provide printed circuit board base materials which are catalytic to vapor deposition of metals, a process for producing these base materials and a process for producing printed circuit boards by using these base materials. ;CONSTITUTION: The high-polymer base materials which contain first catalysts consisting of granular silicate packing materials dispersed into the high- molecular base materials and arom. components dissolved in the polymers of the high-molecular base materials or having the hydroxyl substitutents adhered to these polymers and are catalytic to the vapor deposition of copper, further, the above base materials contg. the second catalysts selected from a group consisting of palladium, platinum, ruthenium, iridium, rhodium, silver or gold and their compds. and mixture; the process for producing these base materials; and the process for producing the printed circuit boards by using these base materials, are provided.;COPYRIGHT: (C)1992,JPO
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