Production manner null of thermoelectric conversion module, and the thermoelectric conversion module which use the semiconductor device material tip/chip which is obtained by the production manner of the semiconductor device material tip/chip, and applying that

摘要

PURPOSE: To rationalize the manufacturing process of chips of a semiconductor element forming material and to provide a thermoelectric conversion module which can reinforce the mechanical strength of the chips. ;CONSTITUTION: Chips of a semiconductor element forming material are manufactured by pouring a molten metal having the composition of an N- or P-type semiconductor compound in a plurality of holes 4a formed in a heat resistant insulating plate 4 by a high pressure or reduced pressure method and unidirectionally solidifying the molten metal. Then NP thermocouples are arranged electrically in series and thermally in parallel by forming the thermocouples in the holes 4a. After a semiconductor element fixing section is prepared by press-fitting semiconductor element chips in small holes of a semiconductor element fixing substrate 3 and a highand low-temperature heat source-side electrode fixing sections are prepared on an electrode insulating substrate by fixing electrodes to the substrate by a resist printing method, the high- and low- temperature heat source-side electrode fixing sections are put together with the semiconductor element fixing section in between so that P- and N-type semiconductor chips can be paired and, at the same time, the chips can be electrically connected in series.;COPYRIGHT: (C)1993,JPO&Japio