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FORMING METHOD OF METAL BUMP, BUMP-FORMING DEVICE, AND TOOL FOR SHAPING BUMP

机译:金属碰头的形成方法,碰头形成装置以及碰头成形工具

摘要

PROBLEM TO BE SOLVED: To provide the forming method of a metal bump that forms the metal bump in a columnar shape for reducing the transmission loss of a signal current, a bump-forming device for forming the bump, and a tool for shaping the bump. SOLUTION: A barrel-shaped bump 8 is formed on an electrode part 5 of a circuit element 6. When a specific load is applied to a tool 11 from the upper part of the bump 8, the outer-periphery surface of the bump is chipped by a cutting edge 12 being stuck to the tool 11. The diameter of the cutting edge 12 is smaller than that of an outer periphery on a horizontal section at the middle part of the barrel-shaped bump 8, and at the same time length in the perpendicular direction of the cutting edge 12 is longer than the height of the bump 8.
机译:解决的问题:提供一种金属凸块的形成方法,该金属凸块形成为圆柱状以减小信号电流的传输损耗的金属凸块,用于形成该凸块的凸块形成装置以及用于对该凸块进行整形的工具。解决方案:桶形凸块8形成在电路元件6的电极部分5上。当从凸块8的上部向工具11施加特定负载时,凸块的外围表面会崩裂通过将切削刃12粘贴在工具11上,切削刃12的直径小于桶状凸块8的中央部的水平部的外周的直径,并且在同一时间长度上为直径。切削刃12的垂直方向比凸块8的高度长。

著录项

  • 公开/公告号JP2001127092A

    专利类型

  • 公开/公告日2001-05-11

    原文格式PDF

  • 申请/专利权人 OKI ELECTRIC IND CO LTD;

    申请/专利号JP19990302057

  • 发明设计人 ITAYA SATORU;

    申请日1999-10-25

  • 分类号H01L21/60;

  • 国家 JP

  • 入库时间 2022-08-22 01:32:36

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