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SHEET CHUCKING DEVICE AND ELECTRONIC COMPONENT PROCESSING APPARATUS USING THE SAME

机译:板卡盘装置和使用该板卡的电子元件处理装置

摘要

PROBLEM TO BE SOLVED: To easily remove a sheet from a prescribed laminate or its lower site sheet. ;SOLUTION: A sheet chucking device 14 comprises a pair of chucking units 42A, 42B capable of chucking a sheet S laminated on a wafer W, and an attitude changing unit 44 for changing the attitudes of the units 42A, 42B. The unit 44 has the units 42A, 42B movable to separate the units 42A, 42B from each other or approach the units 42A, 42B to each other in a substantially surface direction of the sheet S in a state in which the units 42A, 42B chuck the sheet S laminated on the wafer W, and removes the sheet S from the wafer W while partly deflection deforming the sheet S by approaching the units 42A, 42B.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:轻松地从指定的层压板或其下部位置的板上取下一块板。 ;解决方案:薄片夹持装置14包括能够夹持层压在晶片W上的薄片S的一对夹持单元42A,42B,以及用于改变单元42A,42B的姿态的姿态改变单元44。单元44具有单元42A,42B,在单元42A,42B卡紧的状态下,单元42A,42B可移动以使单元42A,42B彼此分离或在片材S的大致表面方向上彼此接近单元42A,42B。片材S层叠在晶片W上,并通过接近单元42A,42B使片材S部分偏转而从晶片W上取下片材。版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP2001196440A

    专利类型

  • 公开/公告日2001-07-19

    原文格式PDF

  • 申请/专利权人 LINTEC CORP;

    申请/专利号JP20000006293

  • 申请日2000-01-12

  • 分类号H01L21/68;B65D85/38;

  • 国家 JP

  • 入库时间 2022-08-22 01:31:44

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