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SHEET CHUCKING DEVICE AND ELECTRONIC COMPONENT PROCESSING APPARATUS USING THE SAME
SHEET CHUCKING DEVICE AND ELECTRONIC COMPONENT PROCESSING APPARATUS USING THE SAME
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机译:板卡盘装置和使用该板卡的电子元件处理装置
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摘要
PROBLEM TO BE SOLVED: To easily remove a sheet from a prescribed laminate or its lower site sheet. ;SOLUTION: A sheet chucking device 14 comprises a pair of chucking units 42A, 42B capable of chucking a sheet S laminated on a wafer W, and an attitude changing unit 44 for changing the attitudes of the units 42A, 42B. The unit 44 has the units 42A, 42B movable to separate the units 42A, 42B from each other or approach the units 42A, 42B to each other in a substantially surface direction of the sheet S in a state in which the units 42A, 42B chuck the sheet S laminated on the wafer W, and removes the sheet S from the wafer W while partly deflection deforming the sheet S by approaching the units 42A, 42B.;COPYRIGHT: (C)2001,JPO
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