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CMP ABRASIVE SLURRY-CONTAINING WASTE WATER TREATING DEVICE

机译:CMP含草浆废水处理装置

摘要

PROBLEM TO BE SOLVED: To provide a CMP abrasive slurry-containing waste water treating device capable of flocculating fine abrasive grain or the like contained in the CMP abrasive slurry-containing waste water discharged from a CMP process and solid/liquid separating to easily recover water containing no solid matter.;SOLUTION: The CMP abrasive slurry-containing waste water treating device has an oxidizing device for oxidizing the CMP abrasive slurry-containing waste water, a flocculation reaction device for performing the flocculation reaction by adding a flocculant to the oxidized waste water and a solid/liquid separation device for separating the solid matter in the waste water, to which the flocculation reaction is applied.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种含CMP研磨剂的废水处理装置,该装置能够使从CMP工序排出的含CMP研磨剂的废水中所含的微细磨粒等凝集,并且能够进行固液分离而容易地回收水。 SOLUTION:含有CMP研磨剂的废水处理装置具有用于氧化含有CMP研磨剂的废水的氧化装置,用于通过向被氧化的废物中添加絮凝剂来进行絮凝反应的絮凝反应装置。水和用于进行絮凝反应的分离废水中固体物质的固/液分离装置。;版权所有:(C)2001,日本特许厅

著录项

  • 公开/公告号JP2001170652A

    专利类型

  • 公开/公告日2001-06-26

    原文格式PDF

  • 申请/专利权人 KURITA WATER IND LTD;

    申请/专利号JP19990353387

  • 发明设计人 MORITA HIROSHI;

    申请日1999-12-13

  • 分类号C02F1/52;C02F1/72;

  • 国家 JP

  • 入库时间 2022-08-22 01:30:56

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