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MANUFACTURING METHOD FOR GOLD WIRE FOR PACKAGE AND THE GOLD WIRE FOR PACKAGE

机译:包装用金线的制造方法及包装用金线

摘要

PROBLEM TO BE SOLVED: To offer a gold wire for package, which has high signal transmission rate and reduces material cost, and its manufacturing method. SOLUTION: This manufacturing method of a gold wire for package is as follows. First, a pure Ag or Pd wire rod 1 is subjected to a drawing process 2, to decrease the diameter of the wire rod 1 to produce a extremely thin core wire 3 with a diameter of 1 to 500 m. Next, the surface of the core wire 3 is plated with pure gold to 0.025 to 25 m in thickness in a plating process 4. Then, quality inspection 5 is performed. Thus, a gold wire 6 for package, which is not made of pure gold only but made by coating the outside of the core wire 3 with pure gold, is obtained. This gold wire 6 for package satisfies the condition of high signal transmission rate, and substantially reduces material cost.
机译:要解决的问题:提供一种用于包装的金线,其具有高的信号传输速率并降低了材料成本,及其制造方法。解决方案:这种用于包装的金线的制造方法如下。首先,对纯的Ag或Pd线材1进行拉丝工艺2,以减小线材1的直径,以制造直径为1至500m的极细芯线3。接下来,在镀覆工序4中,对芯线3的表面镀覆0.025〜25m厚的纯金。然后,进行品质检查5。因此,获得了用于包装的金线6,其不仅仅由纯金制成,而是通过用纯金涂覆芯线3的外部而制成。该用于包装的金线6满足高信号传输率的条件,并且大大降低了材料成本。

著录项

  • 公开/公告号JP2001144133A

    专利类型

  • 公开/公告日2001-05-25

    原文格式PDF

  • 申请/专利权人 SHINMO KAGI KOFUN YUGENKOSHI;

    申请/专利号JP19990316641

  • 发明设计人 CHO DOKO;

    申请日1999-11-08

  • 分类号H01L21/60;

  • 国家 JP

  • 入库时间 2022-08-22 01:29:05

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