CHEMICAL PALLADIUM/GOLD PLATING FILM STRUCTURE, METHOD FOR PRODUCTION THEREOF, PALLADIUM/GOLD PLATING FILM PACKAGE STRUCTURE BONDED WITH COPPER WIRE OR PALLADIUM/COPPER WIRE, AND PACKAGING PROCESS THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a chemical palladium/gold plating film structure, a method for the production thereof, a palladium/gold plating film package structure bonded with a copper wire or a palladium/copper wire, and a packaging process thereof.;SOLUTION: The chemical palladium/gold plating film is situated on a solder pad and comprises a palladium plating layer situated on the solder pad and a gold plating layer situated on the palladium plating layer. The chemical palladium/gold plating film and the copper wire and the palladium/copper wire which are bonded to the gold plating layer by wire bonding form a package structure. This invention also provides a method for producing the chemical palladium/gold plating film and a packaging process for the package structure. In this invention, the palladium plating layer is used instead of a conventional nickel layer, so that the bonding strength of wire bonding between the copper wire or the copper palladium wire and the solder pad can be improved.;COPYRIGHT: (C)2012,JPO&INPIT