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MAIN MOLD FOR ELECTROFORMING, ITS MANUFACTURE AND MANUFACTURE OF STRUCTURAL BODY HAVING PROJECTION PART USING MAIN MOLD FOR ELECTROFORMING

机译:用于电铸的主要模具,其制造以及使用用于电铸的主要模具的具有投影部件的结构体的制造

摘要

PROBLEM TO BE SOLVED: To provide a method capable of efficiently forming a structural body free from any defects or defective shape, and having a projection part of slender section.;SOLUTION: The manufacturing method comprises a process to prepare a composite member provided with a first layer 10 of a conductive material, and a second layer 20 of a non-conductive material formed on an upper layer thereof, a process to provide a groove part 22 reaching an interface between the first layer and the second layer from the surface of the second layer of this composite member, a process to form a conductive film 30 on the surface of the second layer, a process to provide a peelable film 40 on the surface of the second layer and an inner surface of the groove part, and a process to implement the electroforming by connecting the first layer to a negative electrode of a power source, and to precipitate a metal in the groove part and on the surface of the second layer to form a projection part 80b and a body 80a of a structural body 80.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种能够有效地形成没有任何缺陷或缺陷形状并且具有细长截面的突出部的结构体的方法。解决方案:该制造方法包括制备具有以下特征的复合构件的过程:导电材料的第一层10和在其上层上形成的非导电材料的第二层20,提供从第二金属层的表面到达第一层和第二层之间的界面的凹槽部分22的工艺。该复合构件的第二层,在第二层的表面上形成导电膜30的过程,在第二层的表面和凹槽部的内表面上提供可剥离膜40的过程以及过程通过将第一层连接到电源的负电极来实现电铸,并且在凹槽部分和第二层的表面上析出金属以形成突起部分80 b和结构体80的主体80a 。;版权所有:(C)2001,日本特许厅

著录项

  • 公开/公告号JP2001026895A

    专利类型

  • 公开/公告日2001-01-30

    原文格式PDF

  • 申请/专利权人 TOSHIBA MACH CO LTD;

    申请/专利号JP19990200410

  • 发明设计人 NAKAMURA HIROMI;HASEGAWA YUTAKA;

    申请日1999-07-14

  • 分类号C25D1/10;

  • 国家 JP

  • 入库时间 2022-08-22 01:28:59

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