DOUBLE-SIDED CIRCUIT BOARD, MALTILAYER INTERCONNECTION BOARD USING IT, AND MANUFACTURING METHOD OF DOUBLE-SIDED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a double-sided circuit board that can suppress the deformation of a conductor made of solder due to a temperature cycle test, and can maintain high connection reliability. SOLUTION: Circuits 3 are provided on both the surfaces of an insulation layer 2 made of an organic macromolecular resin, and both the circuits 3 are electrically connected by a via hole that is made of a conductor 4 made of solder where metal powder 6 is dispersed.