首页> 外国专利> MONOMER FOR PHOTORESIST AND ITS MANUFACTURE, COPOLYMER FOR PHOTORESIST AND ITS MANUFACTURE, PHOTORESIST COMPOSITION, FORMING METHOD FOR PHOTORESIST PATTERN, AND SEMICONDUCTOR ELEMENT

MONOMER FOR PHOTORESIST AND ITS MANUFACTURE, COPOLYMER FOR PHOTORESIST AND ITS MANUFACTURE, PHOTORESIST COMPOSITION, FORMING METHOD FOR PHOTORESIST PATTERN, AND SEMICONDUCTOR ELEMENT

机译:光致抗蚀剂及其制造用单体,光致抗蚀剂及其制造用共聚物,光致抗蚀剂组成,光致抗蚀剂图案的形成方法和半导体元件

摘要

PROBLEM TO BE SOLVED: To provide a photoresist composition including a copolymer for photoresist usable in far ultraviolet ray region, excellent in post exposure delay stability. SOLUTION: This photoresist composition includes a polymer having a monomer expressed by formula (1) (Z1, Z2, R1, R2, R3, R4, R5 and Z and p are each described in the description), has an excellent resistance to etching and thermal resistance and capable of remarkably improving stability in far ultraviolet ray region, especially post exposure delay stability to resist for ArF.
机译:解决的问题:提供一种光致抗蚀剂组合物,该光致抗蚀剂组合物包括可用于远紫外线区域的,具有优异的后曝光延迟稳定性的用于光致抗蚀剂的共聚物。解决方案:该光刻胶组合物包含具有由式(1)表示的单体的聚合物(Z1,Z2,R1,R2,R3,R4,R5和Z和p分别在说明书中进行了描述),具有出色的耐腐蚀性能和耐热性,并且能够显着改善远紫外线区域的稳定性,尤其是对于ArF的抗蚀剂的曝光后延迟稳定性。

著录项

  • 公开/公告号JP2001122927A

    专利类型

  • 公开/公告日2001-05-08

    原文格式PDF

  • 申请/专利权人 HYUNDAI ELECTRONICS IND CO LTD;

    申请/专利号JP20000246940

  • 申请日2000-08-16

  • 分类号C08F232/00;C07C41/56;C07C43/305;C08F2/06;C08F4/04;C08F4/34;C08F222/06;C08F234/00;C08K5/00;C08K5/04;C08L45/00;G03F7/039;H01L21/027;

  • 国家 JP

  • 入库时间 2022-08-22 01:27:26

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