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METAL BASE PRINTED WIRING BOARD, METAL BASE MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF
METAL BASE PRINTED WIRING BOARD, METAL BASE MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF
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机译:金属基印刷线路板,金属基多层印刷线路板及其制造
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摘要
PROBLEM TO BE SOLVED: To effectively manufacture a metal base multilayer printed wiring board by thermally fusion-welding a conductor foil, in such a manner that thermoplastic resin composition satisfies the relation between heat quantity of crystal melting and heat quantity of crystallization which is generated due to crystallization during temperature rise, at a crystal melting peak temperature of at least a specified value. ;SOLUTION: A conductor foil is thermally fusion-welded on a single side or both sides of a metal plate 1, via an insulating layer 2 composed of thermoplastic resin composition. At this time, the thermoplastic resin composition is thermally fusion- welded, in such a manner that a crystal melting peak temperature which is measured by differential scanning calorimetry when temperature is increased is set as at least 260°C, so that the relation between heat quantity ΔHm of crystal melting and heat quantity ΔHc of crystallization which is generated by crystallization during temperature rise is satisfied according to [(ΔHm-ΔHc)/ΔHm)/ΔHm]≤0.6 and [(ΔHm-ΔHc)/ΔHm]≥0.7. Thereby the characteristics such as heat resistance, chemical resistance and electrical characteristics of a metal based printed wiring board are not controlled by characteristic of adhesive agent, but the wiring board can be manufactured effectively.;COPYRIGHT: (C)2001,JPO
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