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METAL BASE PRINTED WIRING BOARD, METAL BASE MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF

机译:金属基印刷线路板,金属基多层印刷线路板及其制造

摘要

PROBLEM TO BE SOLVED: To effectively manufacture a metal base multilayer printed wiring board by thermally fusion-welding a conductor foil, in such a manner that thermoplastic resin composition satisfies the relation between heat quantity of crystal melting and heat quantity of crystallization which is generated due to crystallization during temperature rise, at a crystal melting peak temperature of at least a specified value. ;SOLUTION: A conductor foil is thermally fusion-welded on a single side or both sides of a metal plate 1, via an insulating layer 2 composed of thermoplastic resin composition. At this time, the thermoplastic resin composition is thermally fusion- welded, in such a manner that a crystal melting peak temperature which is measured by differential scanning calorimetry when temperature is increased is set as at least 260°C, so that the relation between heat quantity ΔHm of crystal melting and heat quantity ΔHc of crystallization which is generated by crystallization during temperature rise is satisfied according to [(ΔHm-ΔHc)/ΔHm)/ΔHm]≤0.6 and [(ΔHm-ΔHc)/ΔHm]≥0.7. Thereby the characteristics such as heat resistance, chemical resistance and electrical characteristics of a metal based printed wiring board are not controlled by characteristic of adhesive agent, but the wiring board can be manufactured effectively.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:为了通过热熔合焊接导体箔来有效地制造金属基多层印刷线路板,以使得热塑性树脂组合物满足晶体熔化的热量与由于热产生的结晶的热量之间的关系。至少在一个特定值的晶体熔融峰值温度下温度升高时发生结晶。 ;解决方案:将导体箔通过由热塑性树脂组合物组成的绝缘层2热熔焊接在金属板1的单面或两侧。此时,将热塑性树脂组合物进行热熔接,使得将温度升高时通过差示扫描量热法测量的晶体熔融峰值温度设定为至少260℃。根据[(ΔHm-ΔHc)/ΔHm)/ΔHm]和0.6;满足晶体熔化的量ΔHm和在温度升高期间由结晶产生的结晶的热量ΔHc。和[(ΔHm-ΔHc)/ΔHm]≥ 0.7。因此,金属基印刷线路板的耐热性,耐化学性和电气特性等特性不受粘合剂特性的控制,但可以有效地制造线路板。;版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP2001036205A

    专利类型

  • 公开/公告日2001-02-09

    原文格式PDF

  • 申请/专利权人 MITSUBISHI PLASTICS IND LTD;

    申请/专利号JP19990209109

  • 申请日1999-07-23

  • 分类号H05K1/05;C08L25/04;C08L101/16;H05K3/44;H05K3/46;

  • 国家 JP

  • 入库时间 2022-08-22 01:27:11

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