RESIN COMPOSITION USED IN PRODUCTION OF MULTILEVEL INTERCONNECTION BOARD, PHOTOSENSITIVE ELEMENT AND PRODUCTION OF MULTILEVEL INTERCONNECTION BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a fine particle-containing resin composition which is used in the production of a multilevel interconnection board or the like and is not exposed in a larger area than a hole in a mask, to obtain a photosensitive element using the resin composition and to produce a multilevel interconnection board in which a via hole having the same size as a mask can be formed. ;SOLUTION: The resin composition contains a resin and fine particles of at least one material having 0.1-10 μm average particle diameter or average aggregation diameter and the difference between the refractive index of the resin and that of the fine particles is ≤±0.07. The photosensitive element includes a layer 2 of the resin composition and a photosensitive insulating resin layer 3, the surface of the photosensitive insulating resin layer 3 has fine ruggedness and the difference between the refractive index of the photosensitive insulating resin layer 3 and that of the fine particles is ≤±0.07. The multilevel interconnection boar is produced using the photosensitive element.;COPYRIGHT: (C)2000,JPO