首页> 外国专利> PLATE THICKNESS DETECTION, PLATE THICKNESS DIFFERENCE DETECTION AND BENDING MACHINE FOR PLATE-SHAPED MATERIAL

PLATE THICKNESS DETECTION, PLATE THICKNESS DIFFERENCE DETECTION AND BENDING MACHINE FOR PLATE-SHAPED MATERIAL

机译:板状材料的板厚检测,板厚差检测及弯曲机

摘要

PROBLEM TO BE SOLVED: To provide a detecting method of plate thickness and a detecting method of plate thickness difference precisely detecting the plate thickness of a plate-shaped work/without errors in line, and to provide a bending machine for a plate-shaped work.;SOLUTION: The bending machine for a plate-shaped work equipped with a punch P and a die D is provided with a measuring device 67 for detecting a gap between the lower face of a measurement position of a plate-shaped work W mounted on the die D and the upper face of the die D, a position detection device which detects a relative approaching position of the punch P to the die D, a contact detection means which detects a contact of the tip of the punch P with the upper face of the plate-shaped work W, and an arithmetic means which calculates the plate thickness of the plate-shaped work W on the basis of the detected value of the position detection device given when the contact detection device detects the contact, and the measuring device 67.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种板厚的检测方法和板厚差的检测方法,以精确地检测板状工件的板厚/没有直线误差,并且提供一种用于板状工件的折弯机解决方案:带有冲头P和模具D的板状工件弯曲机设有测量装置67,用于检测安装在其上的板状工件W的测量位置的下表面之间的间隙。模具D和模具D的上表面,检测冲头P相对于模具D的相对接近位置的位置检测装置,检测冲头P的顶端与上表面的接触的接触检测单元板状工件W的板厚,算术单元根据接触检测装置检测到接触时所给定的位置检测装置的检测值来计算板状工件W的板厚。确保装置67 .;版权:(C)2001,JPO

著录项

  • 公开/公告号JP2001001051A

    专利类型

  • 公开/公告日2001-01-09

    原文格式PDF

  • 申请/专利权人 AMADA ENG CENTER CO LTD;AMADA CO LTD;

    申请/专利号JP19990168702

  • 发明设计人 KOYAMA KATSUMI;

    申请日1999-06-15

  • 分类号B21D5/02;

  • 国家 JP

  • 入库时间 2022-08-22 01:26:32

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号