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Measuring device and measuring method for measuring the thickness of a plate-shaped object and bending machine

机译:用于测量板状物体的厚度的测量装置和测量方法以及弯曲机

摘要

The invention relates to a measuring device (101) for measuring the thickness of a plate-shaped article, comprising a first probe (21) for seating on a first surface of the plate-shaped object and a second to fourth probe (31, 41, 51) for placement on a plate the first surface opposite the second surface of the plate-shaped article comprises. Furthermore, the measuring device (101) comprises means for calculating the thickness of the plate-shaped object based on the positions at which the probes (21-51) touch the plate-shaped object. In addition, a measuring method for measuring the thickness of a plate-shaped article is also given.
机译:本发明涉及一种用于测量板状物品的厚度的测量装置(101),其包括用于放置在板状物体的第一表面上的第一探针(21)和第二至第四探针(31、41)。 ,(51),用于在板上放置与板状制品的第二表面相对的第一表面。此外,测量装置(101)包括用于基于探针(21-51)接触板状物体的位置来计算板状物体的厚度的装置。另外,还给出了用于测量板状物品的厚度的测量方法。

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